Silicide intermetallics are widely used in various applications such as microelectronics, structural and coating industries. Some aspects of the diffusion-controlled growth and oxidation of metal-silicides are presented in this volume of the journal.Table of Contents: Preface Mechanisms of Silicide Formation by Reactive Diffusion in Thin Films Diffusion Rates of Components in Metal-Silicides Depending on Atomic Number of Refractory Metal Component Diffusion-Limited Reactions of Non-Oxide Ceramics with Transition Metals Oxidation Behavior of Silicides Periodic Layer Formation during Multiphase Diffusion in Silicide Systems